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华中科技大学工艺设备及自动化系导师介绍:朱福龙


姓名:朱福龙
电话:***********
职称:副教授
邮箱:zhufulong2@sina.com

►个人基本情况:
男,1974年生,江西省新干县人,华中科技大学机械学院博士、副教授;研究方向为微/纳制造,微米/纳米力学,微电子封装可靠性。攻读博士期间获得华中科技大学第六届“研究生科技十佳”称号等多项荣誉,博士学位论文被评为华中科技大学“校优秀博士论文”。2007年留校参加工作以来,先后参与国家自然基金、863、973、02专项课题多项,现主持部委课题、863项目子课题各一项、发表论文30余篇,申请与授权专利9项,软件版权2项。

►主要研究方向:
微/纳制造
微米/纳米力学
微电子封装可靠性

►开设课程:
功能材料基础

►获得软件版权:
1.封装材料数据库系统V1.02004SR11907(登记号)
2.MEMS封装模拟与仿真库V1.02005SR04366(登记号)

►获得专利:
1.朱福龙,宋劭,张伟,刘胜,王志勇,张鸿海.“一种基于投影莫尔原理的共面度测量系统”.发明专利.专利号:ZL201010548868.7
2.朱福龙,宋劭,张伟,刘胜,王志勇,张鸿海.“一种基于投影莫尔原理的BGA共面度测量系统”.发明专利.专利号:ZL201010548877.6
3.朱福龙,宋劭,张伟,刘胜.“一种利用分形理论优化加热结构的环境加热炉”.实用新型专利.专利号:ZL201120031410.4
4.朱福龙,宋劭,张伟,刘胜.“一种用于微电子封装材料测试的环境加热炉”.实用新型专利.专利号:ZL201120031369.0
5.朱福龙,宋劭,张伟,刘胜,王志勇,张鸿海.“一种基于投影莫尔原理的BGA共面度测量系统”.实用新型专利.专利号:ZL201020612724.9
6.朱福龙,宋劭,张伟,刘胜,王志勇,张鸿海.“一种基于投影莫尔原理的共面度测量系统”.实用新型专利.专利号:ZL201020612694.1
7.王志勇,刘胜,张鸿海,史铁林,汪海英,汪学方,朱福龙.“一种用于微小样品的六轴力学性能测量装置”.实用新型专利.专利号:ZL03237264.7
8.张鸿海,刘华勇,舒霞云,徐裕力,肖峻峰,朱福龙,张丰,王永先.“一种高粘度流体微量喷射点胶装置”.实用新型专利.专利号:ZL200720088827.8
9.张鸿海,刘华勇,舒霞云,徐裕力,肖峻峰,朱福龙,张丰,王永先.“一种高粘度流体微量喷射点胶装置”.发明专利.专利号:ZL200710168669.1

►承担的科研项目:
项目名称:气密MEMS封装工艺及规范任务来源:国家863计划项目(2002AA430030)起止年月:2002.12-2003.12
项目名称:封装材料特性测试及数据库任务来源:国家863计划项目MEMS重大专项(2003AA404016)起止年月:2003.6-2004.12
项目名称:面向石化等重要行业MEMS压力传感器制造与实用化研究务来源:国家863计划项目(2004AA404221)起止年月:2004.10-2005.12
项目名称:低成本、高性能真空熔焊封装关键技术与装备的研究任务来源:国家863计划项目(2005AA404260)止年月:2005.7-2006.6
项目名称:基于荷花效应的MEMS功能表面仿生研究任务来源:国家自然基金项目(50475137)起止年月:2005.01-2007.12
项目名称:基于电磁流体动力学的金属焊料微喷射技术的研究任务来源:国家自然基金项目(50775087)起止年月:2008.01-2010.12
项目名称:系统级封装的基础研究-热管理与热应力务来源:国家973项目子课题(2009CB320203)起止年月:2009.02-2013.2
项目名称:汽车胎压微传感器及系统任务来源:国家863计划项目子课题起止年月:2008.06-2010.1
项目名称:高密度三维系统封装关键技术研究任务来源:国家02重大专项课题(2009ZX02038)起止年月:2010.01-2012.12
项目名称:先进封装工艺开发及产业化任务来源:国家02重大专项课题(2009ZX02024-09)起止年月:2010.01-2012.12
项目名称:基于TSV的三维封装关键技术务来源:国家02重大专项课题起止年月:2010.01-2012.12
项目名称:MEMS器件规模封装技术基础研究任务来源:国家02重大专项课题起止年月:2010.9-2015.09
项目名称:异质微结构表面差异性同步去除与晶圆减薄新原理任务来源:国家973项目子课题(2015CB057203)起止年月:2015.1-2019.12
主持科研项目:
项目名称:关键封装设备、材料应用工程-封装翘曲测量设备的研发和产业化任务来源:国家02重大专项课题(2009ZX02010-041)起止年月:2010.01-2012.12
项目名称:碳纳米管增强无铅互连焊点的界面可靠性研究任务来源:中央高校基本科研业务费资助项目(2011TS066)起止年月:2011.6-2012.12
项目名称:振动对航电产品电连接器的接触电阻影响分析研究任务来源:航空基金(20120279004)起止年月:2012.10-2014.10
项目名称:微振动条件下航电产品电连接器的接触可靠性研究任务来源:中央高校基本科研业务费资助项目(2013TS023)起止年月:2013.6-2014.12
项目名称:基于声光效应的超声功率测量技术研究任务来源:企业委托研究项目(2011TS066)起止年月:2013.6-2014.12
项目名称:第三代半导体封装和系统失效机理与可靠性快速寿命方法研究--材料模型建立,数据处理方法开发(华科子课题)任务来源:国家863计划项目子课题起止年月:2015.01-2017.12

►获奖情况:
获奖项目:系统封装、测试的若干关键技术及装备奖项级别:电子信息技术奖(二等)授奖部门:中国电子学会获奖年月:2009.12
获奖项目:系统封装、测试的若干关键技术及装备奖项级别:科技发明一等奖;授奖部门:中国物流与采购联合会获奖年月:2009.11
获奖项目:高精度一维测试台结构设计及试验奖项级别:湖北省优秀学士学位论文-指导教师;授奖部门:湖北省教育厅、学位办获奖年月:2009.2
获奖项目:胶囊内窥镜的磁导航式运动检测台设计奖项级别:湖北省优秀学士学位论文-指导教师;授奖部门:湖北省教育厅、学位办获奖年月:2010.2
获奖项目:微型胶囊机器人结构设计项级别:湖北省优秀学士学位论文-指导教师;授奖部门:湖北省教育厅、学位办获奖年月:2012.12

►发表的主要论文(通讯作者*):
[1]WeiZhang,FulongZhu*,HonghaiZhang,etal.AnAdjustableSensitivityShadowMoiréTechniqueforSurfaceMorphologyMeasurement.JournalofModernOptics,2014,61(8):641-649.(SCI收录,B类期刊)
[2]WeiZhang,FulongZhu*,YiquanDai,etal.Warpagemeasurementofsiliconwafersofvariousbondingareas.13thInternationalConferenceonElectronicPackagingTechnologyandHighDensityPackaging(ICEPT-HDP),Guilin,2012.1164-1167.(EI收录)
[3]WeiZhang,FulongZhu,ShaoSong,etal.3-Dwarpagemeasurementofsiliconwafe.2ndInternationalConferenceonArtificialIntelligence,ManagementScienceandElectronicCommerce(AIMSEC),DengLeng,2011.3603-3605.(EI收录)
[4]YingLi,FulongZhu*,YanmingChen,KeDuan,KaiTang,ShengLiu,”AnalysisofinsertionforceofelectricconnectorbasedonFEM”,21stInternationalSymposiumonthePhysicalandFailureAnalysisofIntegratedCircuits(IPFA2014)(EI)
[5]KeDuan,FulongZhu*,YingLi,KaiTang,ShengLiu,YanmingChen,”ContactResistanceInvestigationofElectricalConnectorwithDifferentShrinkRange”,The15thInternationalConferenceonElectronicPackagingTechnology(ICEPT2014).(EI)
[6]KeDuan,FulongZhu*,MingxiangChen,YingLi,YanmingChen,”,WarpageAnalysisofDBCSubstratebasedonNon-contactShadowMoiréTechnology”,The15thInternationalConferenceonElectronicPackagingTechnology(ICEPT2014).(EI)
[7]KaiTang,FulongZhu*,YingLi,KeDuan,ShengLiu,YanmingChen,”EffectofDefectsonThermalConductivityofGraphene”The15thInternationalConferenceonElectronicPackagingTechnology(ICEPT2014).(EI)
[8]KaiTang,FulongZhu*,YoukaiChen,YingLi,HengyouLiao,ShengLiu,“MolecularDynamicsSimulationonThermalConductivityofSingle-WalledCarbonNanotubes”,The14thInternationalConferenceonElectronicPackagingTechnology(ICEPT2013).(EI)
[9]KaiTang,FulongZhu*,YoukaiChen,YingLi,HengyouLiao,XiahuiChen,ShengLiu,“EffectofVacancyDefectsonThermalConductivityofSingle-walledCarbonNanotube”,The15thElectronicsPackagingTechnologyConference(EPTC2013).(EI)
[10]YoukaiChen,FulongZhu*,HengyouLiao,ShaoSong,ShengLiu,“TheeffectoftemperatureoncompressivemechanicalbehaviorofSWCNT-Ni”,The13thInternationalConferenceonElectronicPackagingTechnology&HighDensityPackaging(ICEPT-HDP2012).(EI)
[11]YoukaiChen,FulongZhu*,HengyouLiao,ShaoSong,ShengLiu,“CompressingDeformationInvestigationofSingle-WalledCarbonNanotubeCoatedwithNi”,The14thElectronicsPackagingTechnologyConference(EPTC2012).(EI)(注:该论文获得了最佳海报论文奖)
[12]YoukaiChen,FulongZhu*,KaiTang,YingLi,HengyouLiao,ShengLiu,“Mechanicalbehaviorinvestigationofsingle-walledcarbonnanotubeswithonevacancy”,The14thInternationalConferenceonElectronicPackagingTechnology(ICEPT2013).(EI)
[13]YoukaiChen,FulongZhu*,KaiTang,YingLi,HengyouLiao,XiahuiChen,ShengLiu,“MechanicalPropertiesInvestigationofGrapheneCoatedwithNi”,The15thElectronicsPackagingTechnologyConference(EPTC2013).(EI)
[14]HengyouLiao,FulongZhu*,ShengLiu,“MECHANICALSTRETCHINGBEHAVIORSIMULATIONOFSWCNTANDSWCNT-NI”,2011InternationalSymposiumonAdvancedPackagingMaterials(APM)Conference.(EI)
[15]HengyouLiao,FulongZhu*,WeiZhang,“TensilebehaviorsinvestigationofSWCNT-Niwithvacancies”,The13thInternationalConferenceonElectronicPackagingTechnology&HighDensityPackaging(ICEPT-HDP2012).(EI)
[16]HengyouLiao,FulongZhu*,WeiZhang,“TorsionbehaviorsimulationofNi-coatingSWCNTbasedonmoleculardynamics”.The13thInternationalConferenceonElectronicPackagingTechnology&HighDensityPackaging(ICEPT-HDP2012).(EI)
[17]ShaoSong,FulongZhu*,WeiZhang,ShengLiu,“WarpagemeasurementofvarioussubstratesbasedonwhitelightshadowMoirétechnology”,2011InternationalMicrosystems,Packing,AssemblyandCircuitsTechnologyConference(IMPACT2011),Taipei,2011.389-392.(EI收录).(EI)
[18]ZhaohuiChen,ShengjunZhou,ZhichengLv,ChuanLiu,XingChen,XiaoJia,KeZeng,BinSong,FulongZhu,MingxiangChen,XuefangWang,HonghaiZhang,ShengLiu,“ExpertadvisorforintegratedvirtualmanufacturingandreliabilityforTSV/SiPbasedmodules”.2011ElectronicComponentsandTechnologyConference(EI);
[19]DanXie,HonghaiZhang,ShengLiu,FulongZhu,ShengTao,“MechanicalPropertiesInvestigationofPMMAPCandPSduringThermalNanoimprinting”.TheforthInternationalSymposiumonPrecisionMechanicalMeasurements,Hefei,2008(EI)
[20]FulongZhu*,ShaoSong,WeiZhang,ShengLiu,“Creepbehaviorinvestigationoflead-freesolderalloySn96.5Ag3Cu0.5”,201011thInternationalConferenceonElectronicPackagingTechnologyandHighDensityPackaging,ICEPT-HDP2010,p195-198,2010(EI)
[21]FulongZhu*,HonghaiZhang,RongfengGuan,ShengLiu,“InvestigationofMicrostructuresandTensilePropertiesofaSn-CuLead-freeSolderAlloy”,JournalofMaterialsScience:MaterialsinElectronics,200617:385-390.(EI,SCI)
[22]FulongZhu*,HonghaiZhang,RongfengGuan,ShengLiu,“theEffectofTemperatureandStrainRateOntheTensilepropertiesofaSn99.3Cu0.7(Ni)Lead-freeSolderAlloy”,MicroelectronicsEngineering,v84,n1,January,2007,p144-150.(EI,SCI)
[23]FulongZhu*,HonghaiZhang,RongfengGuan,ShengLiu,“EffectsofTemperatureandStrainRateonMechanicalpropertyofSn96.5Ag3Cu0.5”,JournalofAlloysandCompounds,Volume438,Issues1-2,12July2007,Pages100-105.(EI,SCI)
[24]FulongZhu*,HonghaiZhang,RongfengGuan,ShengLiu,MicrostructureandMechanicalPropertiesInvestigationofLead-freeSolderSn99.3Cu0.7,6thInternationalConferenceonElectronicsPackagingTechnology,Shenzhen,China,Aug.30toSep.2nd,2005.(EI)
[25]FulongZhu*,ZhiyongWang,RongfengGuan,HonghaiZhang,“MechanicalPropertiesofaLead-FreeSolderAlloys”,Proceedingsof2005InternationalConferenceonAsianGreenElectronics,Shanghai,China,March15-18,pp.107-112.(EI,ISTP)
[26]ZHUFu-long*,WANGZhi-yong,GUANRong-feng,WANGXue-fang,ZHANGHong-hai,LIUSheng,“SingleAxisMini-TesterofMechanicalPropertyforMicro-Specimen”,The3rdInternationalSymposiumonInstrumentationScienceandTechnology(ISIST2004),Aug.18-22,2004,Xi’an,China,Vol.3,0562-0568.(ISTP)
[27]FulongZhu*,HonghaiZhang,RongfengGuan,ShengLiu,“InvestigationofTemperatureandStrainRateBehaviorofLead-freeSolderSn96.5Ag3.5”,13thInternationalSymposiumonthePhysicalandFailureAnalysisofIntegratedCircuits(IPFA2006),3-7July,2006,Singapore.(ISTP)
[28]FulongZhu*,ZhiyongWang,RongfengGuan,HonghaiZhang,ShengLiu,“MechanicalpropertiesinvestigationofaSnAgsolder”,Proceedingsof2005Internationalconferenceonelectronicspackaging,Tokyo,Japan,April13-15,2005,pp.208-213.
[29]FulongZhu*,HonghaiZhang,RongfengGuan,ShengLiu,“InvestigationofCreepBehaviorsofaLead-freeSolderAlloySn96.5Ag3.5”,7thInternationalConferenceonElectronicsPackagingTechnology,Shanghai,China,Aug.26-29,2006.(EI)
[30]RongfengGuan,FulongZhu,ZhiyinGan,HuangDexiu,ShengLiu,“Stressbirefringenceanalysisofpolarizationmaintainingopticalfibers”,Opticalfibertechnology,v11,n3,July,2005,p240-254.(EI,SCI)
[31]WangZhiyong,ZhuFulong,ZHANGHong-hai,LIUSheng,GUANRong-feng,“ASix-axisMechanicalTesterforMicrospecimens”,The3rdInternationalSymposiumonInstrumentationScienceandTechnology(ISIST2004),Aug.18-22,2004,Xi’an,China,Vol.3,0535-0540.(ISTP)
[32]GuanRongfeng,WangXuefang,ZhuFulong,GanZhiyin,LiuSheng,HuangDexiu,“Studyonplasmacleaningandstrengthofwirebonding”,Proceedingsof2004InternationalConferenceontheBusinessofElectronicProductReliabilityandLiability(EPRL),Apr.,26-29,2004Shanghai,China,p65-71.(EI,ISTP)
[33]GuanRongfeng,GanZhiyin,ZhuFulong,LiuSheng,WangXuefang,“AStudyofAnodicBondingforDie-LevelVacuumPackaging”,7thInternationalConferenceonElectronicsPackagingTechnology,Shanghai,China,Aug.26-29,2006.(EI)
[34]陈四海,汪殿民,朱福龙,徐涌,易新建.微型柔性剪切应力传感器的制作研究.传感器技术,2005(8),81-85
[35]刘文明,王志勇,鲍剑斌,汪学方,关荣锋,朱福龙,刘胜.微陀螺仪的真空回流真空封装工艺研究.微细加工技术,April,2006,p61-64(EI)
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